DUTIES & RESPONSIBILITIES:
1. Develop integrated structural solutions for high-density passive all-optical connectivity (for CPO/NPO/OIO AI computing scenarios), including structural design and optimization of glass-based optical interconnect, heterogeneous integration of passive Chiplet optical engines, and multi-passive-device coupling integration.
2. Develop high-density-compatible optical interface structures and fiber alignment coupling structures to meet ultra-high bandwidth passive all-optical connectivity requirements for AI computing, solving the structural challenges of size matching and low-loss coupling between passive photonic components and fibers/optical waveguides.
3. Collaborate with optical R&D and packaging process teams to complete integration solution verification, optimize process compatibility of integrated structures, and balance integration density, manufacturing cost and product stability.
4. Responsible for reliability verification of integrated passive optical interconnect structures, track test results to complete structural iteration, and output complete structural design documents and process specifications.
5. Track cutting-edge passive optical interconnect integration technologies (such as Corning Glass Bridge glass-based optical interconnect solution), complete technical pre-research and adapt solutions to the company's product roadmap.
SCOPE: Focus on passive optical interconnect integration structure R&D for high-density all-optical connectivity, no circuit design or active chip-level R&D arrangements
EDUCATION:
REQUIRED: Bachelor's degree or above in Mechanical Engineering, Electronic Packaging, Optoelectronic Engineering or related fields
PREFERRED: None
WORK EXPERIENCE:
REQUIRED: 3+ years of R&D experience in semiconductor/optoelectronic integrated passive structure development
PREFERRED: Experience in CPO/silicon photonic passive interconnect integration development is preferred
SKILLS & ABILITIES:
REQUIRED:
• Bachelor's degree or above in Mechanical Engineering, Electronic Packaging, Optoelectronic Engineering or related fields, with 3+ years of R&D experience in semiconductor/optoelectronic integrated passive structure development; experience in CPO/silicon photonic passive interconnect integration development is preferred.
• Proficient in NX/SolidWorks or other structural design tools, master structural simulation and cumulative tolerance analysis methods, and understand basic principles of optical coupling.
• Familiar with structural design requirements for heterogeneous integration and advanced packaging of passive components, and understand the structural processing characteristics of different substrates such as glass substrates and silicon substrates.
• Strong technical pre-research ability and troubleshooting capability, able to independently drive integrated structural project delivery and collaborate smoothly across teams.
PREFERRED:
• Experience in silicon photonic packaging or passive optical engine packaging is preferred
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